3D Inline Automated Solder Paste Inspection
Full view 3D images with high precision data
Mirage series show paste defects in real-time by the whole board view in 3D
Using shadow-free dual digital fringe projectors, Jutze’s highly reliable SPI can fundamentally prevent defects caused during solder printing process, which is suitable for wide variety of practical applications
1.Shadow-free dual digital fringe projectors with outstanding measurement accuracy
2.Intelligent optimized inspection route for best performance
3.Full 3D image view with 100% defect coverage
| Specifications | Mirage | Mirage-D |
| Lighting system | RGB+White LED ring lighting | |
| 3D two direction digital projector | ||
| Vision system | 5M/12M industrial high-speed camera | |
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| Height measuring resolution |
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| Product size | W1080 x D1300 x H1850mm | W1160 x D1470 x H1875mm |
| Weight | 777kg | 950kg |
| FOV size |  |
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| PCB size | 50mm x 70mm ~ 510mm x 460mm | Single lane: 50mm x 70mm ~ 510mm x 590mm Dual lane: 50mm x 70mm ~ 510mm x 330mm |
| PCB thickness | 0.6 ~ 6.0mm | |
| Warpage compensation | 3mm | |
| Inspection theory | 2D+3D image data analysis | |
| Inspection speed | 350ms/FOV (2D+3D) | |
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Inspection defects |
Insufficient paste, excessive paste, bridging, shifting, no paste, shorts, icicles, shape defect, etc. |
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Conveyor system |
PCB fix clamping method: Bottom-up fix board clamping; Automatic loading and unloading; Automatic system rail widge adjustment, SMEMA standard; Rail height: 900±20mm |
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Power requirements |
AC 220V 5-/60Hz 1.8KVA |
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Air requirements |
0.5 MPa |
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Environment |
Temperature: 5-40°C, Humidity: 25%-80%RH |
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Interfaces |
SMEMA |
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